Leepoxy Technical Bulletins - Epoxy Matrix and Urethanes Formulator Composites BF3 BCL3


	Technical Bulletins Reference Table	see also Leecure B Hardners

Technical Bulletins are sorted by Product Line & Application. Most Product Lines will have a Technical Bulletin - Overview and many Applications will have a specific associated Bulletin.

Product	Description	TechBulletin
Boron Trifluoride Products
Boron Trifluoride Catalog	Catalog of Leepoxy's BF3 line	TB_Leecure_B
LEECURE B-110	Reactive BF3 epoxy catalyst	TB_B-110
LEECURE B-115	Reactive BF3 epoxy catalyst	TB_B-115
LEECURE B-170	Reactive BF3 epoxy catalyst	TB_B-170
LEECURE B-550	Highly latent BF3 epoxy catalyst	TB_B-550
LEECURE B-610	Most reactive BF3 epoxy catalyst	TB_B-610
LEECURE B-612	Very reactive BF3 epoxy catalyst	TB_B-612
LEECURE B-614	Reactive BF3 epoxy catalyst	TB_B-614
LEECURE B-950	Latent BF3 epoxy catalyst	TB_B-950
LEECURE B-1310	Reactive BF3 epoxy catalyst	TB_B-1310
LEECURE B-1550	Most latent BF3 epoxy catalyst	TB_B-1550
LEECURE B-1850	Latent BF3 epoxy catalyst	TB_B-1850
LEECURE 31-43 B	Aromatic high-temperature performance	TB_31-43_B
LEECURE 36-98-2 B	Very reactive BF3 epoxy catalyst	TB_36-98-2_B

Boron Trichloride Product
LEECURE 38-239 B	Most latent anhydride accelerator	TB_38-239_B

Custom Epoxy Adhesive
LEEBOND E11130-1	Motor assembly adhesive	TB_E11130-1

Custom Epoxy Encapsulants
LEECAST E15095-2	Telecommunication encapsulant	TB_E15095-2
LEECAST E15095-3	Telecommunication encapsulant	TB_15095-3
LEECAST E16046-1	PC board/UL circuitry encapsulant	TB_E16046-1
LEECAST E16063-1	PC board/UL circuitry encapsulant	TB_E16063-1
LEECAST E19031-2	Automotive module encapsulant	TB_E19031-2
LEECAST E22099-6	Anode potting compound	TB_Anode_Potting
LEECAST E29192-1	PC board/UL circuitry encapsulant	TB_E29192-1

Custom Epoxy Curatives
LEECURE E-6	Anode potting compound	TB_Anode_Potting
LEECURE E-36	Anode potting compound	TB_Anode_Potting

Custom Epoxy Compounds
LEEPOXY E08046-1	Freon-resistant wire patch	TB_E08046-1
LEEPOXY E30025-1	Loudspeaker cone/coil adhesive	TB_E30025-1
LEEPOXY E33148-3	Rotor/armature counterbalancing	TB_E33148-3

Custom Urethane Products
LEECAST U23130-5	Flexible UL electrical encapsulant	TB_U23130-5
LEECAST U30125-1	Hard electrical-grade casting compound	TB_U30125-1

TABLE I
TYPICAL PROPERTIES OF LEECURE B HARDENERS
	B-610	B-612	B-614	B-1310	B-110	B-950	B-550	B-1550
Color	Blue-Brown	Blue-Brown	Brown	Brown	Brown	Brown	Brown	Amber
Viscosity @ 25^oC, cps	15,000	17,000	19,000	15,000	14,000	22,000	28,000	14,000
Density, lbs/gal	9.2	9.3	9.5	9.4	9.3	10.0	10.6	9.9
Suggested Cure Time in 3/16 inch bead, time/bondline temp	3 min/ 25^oC	6 min/ 25^oC	2 min/ 65^oC	5 min/ 65^oC	10 min/ 100^oC	1 hour/ 100^oC	1 hour/ 135^oC	1 hour/ 150^oC
The following typical properties are obtained in conjunction with Bisphenol A Epoxy Resin (EEW=189)
Mix Ratio, phr	8 – 12	8 – 12	8 – 12	8 – 12	8 – 12	4 – 6	4 – 6	4 – 6
Pot Life @ 25^oC, 11g	20 sec	75 sec	13 min	20 min	5 hours	----	----	----
Pot Life @ 25^oC, 100g	----	----	----	----	----	8 hours	2.5 mo	4 mo
Typical cured properties according to suggested cure cycle
Tensile Strength, psi	1,000	1,000	2,000	4,000	10,600	9,000	11,900	9,250
Tensile Modulus, psi	----	----	480,000	480,000	480,000	480,000	450,000	350,000
Tensile Elongation, %	----	----	4	4	4	4	4	3
Heat Deflection Temperature, ^oC	70	75	78	78	86	91	123	130
Dielectric Constant, 1 mHz @ 25^oC	----	----	3.9	3.9	3.9	3.8	3.9	3.9
Dissipation Factor, 1 mHz @ 25^oC	----	----	0.018	0.018	0.018	0.014	0.018	0.024
Volume Resistivity @ 25^oC, ohm-cm	----	----	10¹⁵	10¹⁵	10¹⁵	10¹⁴	10¹⁵	10¹⁵
Volume Resistivity @ 130^oC, ohm-cm	----	----	10¹⁰	10¹⁰	10¹⁰	10⁹	10¹⁴	10¹¹
HDT’s increase with an elevated temperature post-cure. Post-cure can be realized by temperatures generated in use or operation - see also TB_Leepoxy_B.pdf